GENEVA, Oct. 5 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), TOPPANホールディングス株式会社 (東京都台東区台東1丁目5番1号) filed a patent application (PCT/JP2025/011487) for "LAMINATE, PACKAGING MATERIAL, PACKAGING BAG, AND PACKAGE" on Mar 24, 2025. With publication no. WO/2025/205626, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...