INTERNATIONAL PATENT: TOMOEGAWA CORPORATION, 株式会社巴川コーポレーション FILES APPLICATION FOR "BONDING LAYER, HEAT TRANSFER DEVICE AND PRODUCITON METHOD FOR BONDING LAYER"

GENEVA, Feb. 25 -- TOMOEGAWA CORPORATION (2-1-3 Kyobashi, Chuo-ku, Tokyo1048335), 株式会社巴川コーポレーション (東京都中央区京橋二丁目１番３号) filed a patent application (PCT/JP2024/029081) for "BONDING LAYER, HEAT TRANSFER DEVICE, AND PRODUCITON METHOD FOR BONDING LAYER" on Aug 15, 2024. With publication no. WO/2025/037640, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization...