GENEVA, Sept. 9 -- TOKYO OHKA KOGYO CO., LTD. (150, Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa2110012), 東京応化工業株式会社 (神奈川県川崎市中原区中丸子１５０番地) filed a patent application (PCT/JP2025/004208) for "NEGATIVE PHOTOSENSITIVE RESIN FILM, MULTILAYER FILM, DRY FILM, CURED PRODUCT, HOLLOW STRUCTURE, AND PRINTED WIRING BOARD" on Feb 07, 2025. With publication no. WO/2025/182533, the details related to the patent application was published on Sep 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, w...