GENEVA, May 5 -- TOKYO OHKA KOGYO CO., LTD. (150, Nakamaruko, Nakahara-ku, Kawasaki-shi, Kanagawa2110012), 東京応化工業株式会社 (神奈川県川崎市中原区中丸子１５０番地) filed a patent application (PCT/JP2024/037859) for "FILM-FORMING COMPOSITION, CURED FILM, PRODUCTION METHOD FOR CURED FILM, PRODUCTION METHOD FOR MULTILAYER BODY, AND CO2 SEPARATION METHOD" on Oct 24, 2024. With publication no. WO/2025/089319, the details related to the patent application was published on May 01, 2025.
Notably, the patent application was submitted under the International Patent Classification (...