INTERNATIONAL PATENT: TOKUYAMA CORPORATION, 株式会社トクヤマ, DOWA METALTECH CO., LTD., ＤＯＷＡメタルテック株式会社 FILES APPLICATION FOR "ALUMINUM NITRIDE SINTERED SUBSTRATE, METHOD FOR PRODUCING SAME AND INSULATING SUBSTRATE FOR ELECTRONIC CIRCUIT"

Posted On: 2025-09-29

GENEVA, Sept. 29 -- TOKUYAMA CORPORATION (1-1, Mikage-cho, Shunan-shi, Yamaguchi7458648), 株式会社トクヤマ (山口県周南市御影町１番１号), DOWA METALTECH CO., LTD. (4-14-1, Sotokanda, Chiyoda-ku, Tokyo1010021), ＤＯＷＡメタルテック株式会社 (東京都千代田区外神田四丁目１４番１号) filed a patent application (PCT/JP2025/000381) for "ALUMINUM NITRIDE SINTERED SUBSTRATE, METHOD FOR PRODUCING SAME, AND INSULATING SUBSTRATE FOR ELECTRONIC...

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INTERNATIONAL PATENT: TOKUYAMA CORPORATION, 株式会社トクヤマ, DOWA METALTECH CO., LTD., ＤＯＷＡメタルテック株式会社 FILES APPLICATION FOR "ALUMINUM NITRIDE SINTERED SUBSTRATE, METHOD FOR PRODUCING SAME AND INSULATING SUBSTRATE FOR ELECTRONIC CIRCUIT"