GENEVA, May 12 -- TOKURIKI HONTEN CO., LTD. (2-9-12, Kaji-cho, Chiyoda-ku, Tokyo1018548), 株式会社徳力本店 (東京都千代田区鍛冶町２丁目９番１２号) filed a patent application (PCT/JP2024/036630) for "METHOD FOR MANUFACTURING CU-AG ALLOY WIRE MATERIAL, CU-AG ALLOY WIRE MATERIAL MANUFACTURED THEREBY, AND PROBE PIN FOR INSPECTING ELECTRIC/ELECTRONIC COMPONENT OBTAINED USING CU-AG ALLOY WIRE MATERIAL" on Oct 15, 2024. With publication no. WO/2025/094654, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the Interna...