GENEVA, July 8 -- TOAGOSEI CO., LTD. (1-14-1, Nishi-Shimbashi, Minato-ku, Tokyo1058419), 東亞合成株式会社 (東京都港区西新橋一丁目１４番１号) filed a patent application (PCT/JP2024/044292) for "ADHESIVE COMPOSITION, BONDING FILM, LAMINATE EQUIPPED WITH ADHESIVE LAYER, ELECTROMAGNETIC SHIELD MATERIAL, AND LAMINATE" on Dec 13, 2024. With publication no. WO/2025/142568, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property O...