INTERNATIONAL PATENT: TMEIC CORPORATION, 株式会社ＴＭＥＩＣ FILES APPLICATION FOR "PLATE THICKNESS CONTROL DEVICE OF ROLLING MILL"

GENEVA, April 19 -- TMEIC CORPORATION (3-1-1, Kyobashi, Chuo-ku, Tokyo1040031), 株式会社ＴＭＥＩＣ (東京都中央区京橋三丁目１番１号) filed a patent application (PCT/JP2023/036763) for "PLATE THICKNESS CONTROL DEVICE OF ROLLING MILL" on Oct 10, 2023. With publication no. WO/2025/079142, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TEZUKA, Tomoyuki (c/o TMEIC Corporation, 3-1-1, K...