GENEVA, July 3 -- THREEBOND CO., LTD. (4-3-3 Minamiosawa, Hachioji-shi, Tokyo1920398), 株式会社スリーボンド (東京都八王子市南大沢四丁目３番地３) filed a patent application (PCT/JP2024/044624) for "MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE, SEALING AGENT, AND CURED OBJECT" on Dec 17, 2024. With publication no. WO/2025/135036, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO). ...