GENEVA, Sept. 9 -- THREEBOND CO., LTD. (4-3-3 Minamiosawa, Hachioji-shi, Tokyo1920398), 株式会社スリーボンド (東京都八王子市南大沢四丁目３番地３) filed a patent application (PCT/JP2025/005443) for "HEAT-DISSIPATING RESIN COMPOSITION AND CURED PRODUCT THEREOF" on Feb 18, 2025. With publication no. WO/2025/182684, the details related to the patent application was published on Sep 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OGA...