INTERNATIONAL PATENT: THINKTRANS ELECTRONIC MATERIALS SHENZHEN CO., LTD., 深圳市新创元电子材料有限公司 FILES APPLICATION FOR "COPPER-CLAD PLATE WITH PLATED-THROUGH HOLE, CIRCUIT BOARD WITH PLATED-THROUGH HOLE AND MANUFACTURING METHODS THEREFOR"

Posted On: 2025-03-30

GENEVA, March 30 -- THINKTRANS ELECTRONIC MATERIALS SHENZHEN CO., LTD. (Bldg A, No 20 Songtang Road, Tangxiayong, Yanluo, Bao'an DistrictShenzhen, Guangdong 518105), 深圳市新创元电子材料有限公司 (中国广东省深圳市宝安区燕罗街道塘下涌社区松塘路 20 号厂房 A 栋整套) filed a patent application (PCT/CN2024/114974) for "COPPER-CLAD PLATE WITH PLATED-THROUGH HOLE, CIRCUIT BOARD WITH PLATED-THROUGH HOLE, AND MANUFACTURING METHODS THEREFOR" on Aug 28, 2024. With publication no. WO/2025/060833, the...

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INTERNATIONAL PATENT: THINKTRANS ELECTRONIC MATERIALS SHENZHEN CO., LTD., 深圳市新创元电子材料有限公司 FILES APPLICATION FOR "COPPER-CLAD PLATE WITH PLATED-THROUGH HOLE, CIRCUIT BOARD WITH PLATED-THROUGH HOLE AND MANUFACTURING METHODS THEREFOR"