INTERNATIONAL PATENT: THE UNIVERSITY OF TOKYO, 国立大学法人 東京大学 FILES APPLICATION FOR "POLYSACCHARIDE-DERIVED THERMOPLASTIC RESIN HAVING HIGH HEAT RESISTANCE AND LOW DIELECTRIC CONSTANT"

GENEVA, April 28 -- THE UNIVERSITY OF TOKYO (3-1, Hongo 7-chome, Bunkyo-ku, Tokyo1138654), 国立大学法人　東京大学 (東京都文京区本郷七丁目３番１号) filed a patent application (PCT/JP2024/035780) for "POLYSACCHARIDE-DERIVED THERMOPLASTIC RESIN HAVING HIGH HEAT RESISTANCE AND LOW DIELECTRIC CONSTANT" on Oct 07, 2024. With publication no. WO/2025/084183, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organ...