GENEVA, Feb. 17 -- THE UNIVERSITY OF TOKYO (3-1, Hongo 7-chome, Bunkyo-ku Tokyo1138654), 国立大学法人　東京大学 (東京都文京区本郷七丁目３番１号), ABE Kozo (2-19-17 Tetsuryu, Yahatanishi-ku, Kitakyushu-City Fukuoka8060058), 阿部　耕三 (福岡県北九州市八幡西区鉄竜２丁目１９－１７) filed a patent application (PCT/JP2024/027912) for "METHOD AND DEVICE FOR DICING SIC WAFER" on Aug 05, 2024. With publication no. WO/2025/033382, the details r...