INTERNATIONAL PATENT: THE UNIVERSITY OF OSAKA, 国立大学法人大阪大学, HAKKO CORPORATION, 白光株式会社 FILES APPLICATION FOR "SOLDERING DEVICE AND NON-TRANSITORY COMPUTER-READABLE MEDIUM"

GENEVA, July 14 -- THE UNIVERSITY OF OSAKA (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号), HAKKO CORPORATION (2-4-5 Shiokusa, Naniwa-ku, Osaka-shi, Osaka5560024), 白光株式会社 (大阪府大阪市浪速区塩草２－４－５) filed a patent application (PCT/JP2024/046479) for "SOLDERING DEVICE AND NON-TRANSITORY COMPUTER-READABLE MEDIUM" on Dec 27, 2024. With publication no. WO/2025/146822, the details related to the patent application was publi...