INTERNATIONAL PATENT: THE CHINESE UNIVERSITY OF HONG KONG, 香港中文大学 FILES APPLICATION FOR "OXIDE DISPERSION STRENGTHENED METAL POWDER FOR 3D PRINTING AND PREPARATION METHOD THEREFOR"

GENEVA, Oct. 26 -- THE CHINESE UNIVERSITY OF HONG KONG (The Chinese University of Hong Kong, Shatin, N.T.Hong Kong), 香港中文大学 (中国香港特别行政区新界沙田香港中文大学) filed a patent application (PCT/CN2024/088956) for "OXIDE DISPERSION STRENGTHENED METAL POWDER FOR 3D PRINTING AND PREPARATION METHOD THEREFOR" on Apr 19, 2024. With publication no. WO/2025/217932, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Prop...