INTERNATIONAL PATENT: THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, 中国电子科技集团公司第十三研究所 FILES APPLICATION FOR "MULTI-FACE HERMETIC PACKAGE CERAMIC ENCLOSURE, MULTI-FACE PACKAGE DEVICE AND MANUFACTURING METHOD"

GENEVA, Oct. 18 -- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION (No.113 Cooperation RoadShijiazhuang, Hebei 050051), 中国电子科技集团公司第十三研究所 (中国河北省石家庄市合作路113号) filed a patent application (PCT/CN2024/106310) for "MULTI-FACE HERMETIC PACKAGE CERAMIC ENCLOSURE, MULTI-FACE PACKAGE DEVICE, AND MANUFACTURING METHOD" on Jul 19, 2024. With publication no. WO/2025/213616, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent ...