GENEVA, May 27 -- TERAOKA SEISAKUSHO CO., LTD. (4-22, Hiromachi 1-chome, Shinagawa-ku, Tokyo1408711), 株式会社寺岡製作所 (東京都品川区広町１丁目４番２２号) filed a patent application (PCT/JP2023/040993) for "THERMOSETTING ACRYLIC RESIN COMPOSITION AND ADHESIVE SHEET OR ADHESIVE TAPE" on Nov 14, 2023. With publication no. WO/2025/104829, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inv...