GENEVA, June 22 -- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED (35/F, Tencent Building, Kejizhongyi Road, Midwest District of Hi-tech Park, Nanshan DistrictShenzhen, Guangdong 518057), 腾讯科技（深圳）有限公司 (中国广东省深圳市南山区高新区科技中一路腾讯大厦35层) filed a patent application (PCT/CN2024/109314) for "HAPTIC-SIGNAL INTERPOLATION METHOD AND APPARATUS, AND ELECTRONIC DEVICE AND STORAGE MEDIUM" on Aug 01, 2024. With publication no. WO/2025/123705, the details related to the patent application was published on Jun 19, ...