GENEVA, March 9 -- TEIKOKU TAPING SYSTEM CO., LTD. (43-1, Harabuto, Kagiya-cho, Tokai-shi, Aichi4770032), テイコクテーピングシステム株式会社 (愛知県東海市加木屋町腹太４３の１) filed a patent application (PCT/JP2024/027154) for "SEMICONDUCTOR MANUFACTURING DEVICE AND FILM-CUTTING MECHANISM" on Jul 30, 2024. With publication no. WO/2025/047254, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the...