INTERNATIONAL PATENT: TEIJIN LIMITED, 帝人株式会社 FILES APPLICATION FOR "REINFORCING MATERIAL FOR HYDRATED AND SOLIDIFIED BODIES AND HYDRATED AND SOLIDIFIED BODY"

GENEVA, April 28 -- TEIJIN LIMITED (2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi Osaka5300005), 帝人株式会社 (大阪府大阪市北区中之島三丁目２番４号) filed a patent application (PCT/JP2024/035718) for "REINFORCING MATERIAL FOR HYDRATED AND SOLIDIFIED BODIES, AND HYDRATED AND SOLIDIFIED BODY" on Oct 07, 2024. With publication no. WO/2025/084173, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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