INTERNATIONAL PATENT: TECHSTORM ADVANCED MATERIAL CORPORATION LIMITED, 道生天合材料科技（上海）股份有限公司 FILES APPLICATION FOR "HIGH-STABILITY LOW-EXOTHERMIC STRUCTURAL ADHESIVE SYSTEM MATERIAL, PREPARATION METHOD THEREFOR AND USE THEREOF"

GENEVA, Oct. 12 -- TECHSTORM ADVANCED MATERIAL CORPORATION LIMITED (Building 1-3No. 308 Pingda RoadFengxian DistrictShanghai 201400), 道生天合材料科技（上海）股份有限公司 (中国上海市奉贤区平达路308号1-3幢) filed a patent application (PCT/CN2024/119758) for "HIGH-STABILITY LOW-EXOTHERMIC STRUCTURAL ADHESIVE SYSTEM MATERIAL, PREPARATION METHOD THEREFOR AND USE THEREOF" on Sep 19, 2024. With publication no. WO/2025/208804, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the Intern...