INTERNATIONAL PATENT: TECHSTORM ADVANCED MATERIAL CORPORATION LIMITED, 道生天合材料科技（上海）股份有限公司 FILES APPLICATION FOR "BI-COMPONENT POLYURETHANE HEAT-CONDUCTING STRUCTURAL ADHESIVE THAT CAN BE EASILY ADHERED TO BLUE FILM AND PREPARATION METHOD THEREFOR"

GENEVA, July 7 -- TECHSTORM ADVANCED MATERIAL CORPORATION LIMITED (Building 1-3, No. 308 Pingda Road, Fengxian DistrictShanghai 201400), 道生天合材料科技（上海）股份有限公司 (中国上海市奉贤区平达路308号1-3幢) filed a patent application (PCT/CN2024/119753) for "BI-COMPONENT POLYURETHANE HEAT-CONDUCTING STRUCTURAL ADHESIVE THAT CAN BE EASILY ADHERED TO BLUE FILM, AND PREPARATION METHOD THEREFOR" on Sep 19, 2024. With publication no. WO/2025/139098, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was...