GENEVA, Sept. 9 -- TECHNO-UMG CO., LTD. (1-9-2, Higashi-Shimbashi, Minato-ku, Tokyo1050021), テクノＵＭＧ株式会社 (東京都港区東新橋一丁目９番２号) filed a patent application (PCT/JP2024/042265) for "VIBRATION-DAMPING PROPERTY-IMPARTING MATERIAL, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE" on Nov 29, 2024. With publication no. WO/2025/182203, the details related to the patent application was published on Sep 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizatio...