GENEVA, June 24 -- TANAKA DENSHI KOGYO K.K. (2303-15 Yoshida, Yoshinogari-cho, Kanzaki-gun, Saga8420031), 田中電子工業株式会社 (佐賀県神埼郡吉野ヶ里町吉田２３０３－１５) filed a patent application (PCT/JP2024/043105) for "COPPER BONDING RIBBON, METHOD FOR MANUFACTURING COPPER BONDING RIBBON, AND SEMICONDUCTOR DEVICE" on Dec 05, 2024. With publication no. WO/2025/126953, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...