GENEVA, March 24 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2023/033629) for "SOLDER ALLOY, SOLDER PASTE, JOINING PART, JOINING STRUCTURE, AND ELECTRONIC CONTROL DEVICE" on Sep 14, 2023. With publication no. WO/2025/057387, the details related to the patent application was published on Mar 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Propert...