GENEVA, Oct. 5 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku, Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2025/008021) for "RESIN FILM, RESIN-EQUIPPED COPPER FOIL, MULTILAYER WIRING BOARD, COIL STRUCTURE, AND MAGNETIC DEVICE" on Mar 05, 2025. With publication no. WO/2025/204641, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectua...