INTERNATIONAL PATENT: TAMURA CORPORATION, 株式会社タムラ製作所 FILES APPLICATION FOR "RESIN FILM, MULTILAYER WIRING BOARD, COPPER FOIL WITH RESIN, COIL STRUCTURE AND MAGNETIC DEVICE"

GENEVA, June 11 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku, Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2024/041224) for "RESIN FILM, MULTILAYER WIRING BOARD, COPPER FOIL WITH RESIN, COIL STRUCTURE, AND MAGNETIC DEVICE" on Nov 21, 2024. With publication no. WO/2025/115742, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...