GENEVA, Sept. 29 -- TAMURA CORPORATION (1-19-43, Higashi-Oizumi, Nerima-ku Tokyo1788511), 株式会社タムラ製作所 (東京都練馬区東大泉１丁目１９番４３号) filed a patent application (PCT/JP2024/010784) for "BONDING MATERIAL" on Mar 19, 2024. With publication no. WO/2025/196955, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAKANO Takeshi (c/o Iruma Factory, TA...