GENEVA, Sept. 16 -- T. RAD CO., LTD. (3-25-3 Yoyogi, Shibuya-ku, Tokyo1510053), 株式会社ティラド (東京都渋谷区代々木３丁目２５番３号) filed a patent application (PCT/JP2025/006258) for "PACKING MATERIAL FOR HEADER PLATE OF HEAT EXCHANGER, AND HEAT EXCHANGER" on Feb 25, 2025. With publication no. WO/2025/187464, the details related to the patent application was published on Sep 11, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MURAYAMA, Tadash...