INTERNATIONAL PATENT: T-HEAD (SHANGHAI) SEMICONDUCTOR CO., LTD., 平头哥（上海）半导体技术有限公司 FILES APPLICATION FOR "PACKAGING STRUCTURE, INTEGRATED CIRCUIT, MEMORY AND ELECTRONIC DEVICE"

Posted On: 2025-09-15

GENEVA, Sept. 15 -- T-HEAD (SHANGHAI) SEMICONDUCTOR CO., LTD. (5th Floor Number 2 Chuan He Road 55, Number 366 Shang Ke Road, Shanghai Free Trade Area, ChinaPudong New Area, Shanghai 201203), 平头哥（上海）半导体技术有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区上科路366号、川和路55弄2号5层) filed a patent application (PCT/CN2024/120135) for "PACKAGING STRUCTURE, INTEGRATED CIRCUIT, MEMORY AND ELECTRONIC DEVICE" on Sep 20, 2024. With publicatio...

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INTERNATIONAL PATENT: T-HEAD (SHANGHAI) SEMICONDUCTOR CO., LTD., 平头哥（上海）半导体技术有限公司 FILES APPLICATION FOR "PACKAGING STRUCTURE, INTEGRATED CIRCUIT, MEMORY AND ELECTRONIC DEVICE"