INTERNATIONAL PATENT: SUZHOU K-HIRAGAWA ELECTRONIC TECHNOLOGY CO., LTD., 苏州可川电子科技股份有限公司 FILES APPLICATION FOR "SHAPE STAMPING AND BENDING COMBINED PROCESS"

GENEVA, June 29 -- SUZHOU K-HIRAGAWA ELECTRONIC TECHNOLOGY CO., LTD. (1 Zhipu Road, Qiandeng Town, KunshanSuzhou, Jiangsu 215300), 苏州可川电子科技股份有限公司 (中国江苏省苏州市昆山市千灯镇支浦路1号) filed a patent application (PCT/CN2024/083827) for "SHAPE STAMPING AND BENDING COMBINED PROCESS" on Mar 26, 2024. With publication no. WO/2025/129834, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the...