GENEVA, May 4 -- SUZHOU INNOVATION SEMICONDUCTOR EQUIPMENT CO., LTD (Room 103, South Side Of No.5 Standard Factory Building, No.98 Hengshan Road, Suzhou National New & Hi-Tech Industrial Development ZoneSuzhou, Jiangsu 215000), 苏州芯长源半导体设备有限公司 (中国江苏省苏州市高新区横山路98号新技术产业园5号标准厂房南侧103) filed a patent application (PCT/CN2023/135236) for "AUTOMATIC WELDING GOLD WIRE FEEDING MECHANISM FOR BONDING MACHINE FOR CHIP MACHINING" on Nov 29, 2023. With publication no. ...