GENEVA, June 2 -- SUMIDA CORPORATION (KDX Ginza East Building 7F, 3-7-2, Irifune, Chuo-ku, Tokyo1040042), スミダコーポレーション株式会社 (東京都中央区入船三丁目7番2号KDX銀座イーストビル7階) filed a patent application (PCT/JP2023/042032) for "PACKAGING MATERIAL, PACKAGED ELECTRONIC COMPONENT, AND PACKAGING METHOD" on Nov 22, 2023. With publication no. WO/2025/109726, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was sub...