INTERNATIONAL PATENT: SUMIDA CORPORATION, スミダコーポレーション株式会社 FILES APPLICATION FOR "COIL COMPONENT AND METHOD FOR ASSEMBLING COIL COMPONENT"

GENEVA, July 8 -- SUMIDA CORPORATION (KDX Ginza East Building 7F, 3-7-2, Irifune, Chuo-ku, Tokyo1040042), スミダコーポレーション株式会社 (東京都中央区入船三丁目７番２号　ＫＤＸ銀座イーストビル７階) filed a patent application (PCT/JP2023/046590) for "COIL COMPONENT AND METHOD FOR ASSEMBLING COIL COMPONENT" on Dec 26, 2023. With publication no. WO/2025/141680, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted u...