GENEVA, Dec. 22 -- SUMCO CORPORATION (2-1, Shibaura 1-chome, Minato-ku, Tokyo1058634), 株式会社ＳＵＭＣＯ (東京都港区芝浦一丁目２番１号) filed a patent application (PCT/JP2025/017596) for "WAFER APPEARANCE INSPECTION DEVICE AND WAFER APPEARANCE INSPECTION METHOD" on May 14, 2025. With publication no. WO/2025/258312, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OSADA Tatsuya (c/o SUMC...