GENEVA, May 11 -- SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD. (Spreadtrum Center, Building No.1, Lane 2288, Zuchongzhi Road, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 201203), 展讯通信(上海)有限公司 (中国上海市浦东新区(上海)自由贸易试验区祖冲之路2288弄展讯中心1号楼) filed a patent application (PCT/CN2024/126054) for "HYBRID PACKAGE-ON-PACKAGE STRUCTURE" on Oct 21, 2024. With publication no. WO/2025/092477, the details related to the patent application was pub...
Click here to read full article from source
To read the full article or to get the complete feed from this publication, please
Contact Us.