INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE"

GENEVA, Aug. 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2024/042302) for "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Nov 29, 2024. With publication no. WO/2025/158775, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted...