INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE"

GENEVA, June 10 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2024/035584) for "SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Oct 04, 2024. With publication no. WO/2025/115400, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitte...