INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE, MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE"

GENEVA, May 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2024/036736) for "SEMICONDUCTOR PACKAGE, MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE" on Oct 16, 2024. With publication no. WO/2025/089140, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the Inte...