GENEVA, April 19 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2024/029254) for "PACKAGE AND METHOD FOR MANUFACTURING PACKAGE" on Aug 19, 2024. With publication no. WO/2025/079331, the details related to the patent application was published on Apr 17, 2025.
Notably, the patent application was submitted under the International Patent Classification (I...