GENEVA, Dec. 1 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/016462) for "PACKAGE, LEAD FRAME, AND METHOD FOR MANUFACTURING PACKAGE" on May 01, 2025. With publication no. WO/2025/243813, the details related to the patent application was published on Nov 27, 2025.
Notably, the patent application was submitted under the International Patent Classi...