INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "OPTICAL PACKAGE, OPTICAL PACKAGE PRODUCTION METHOD AND ELECTRONIC DEVICE"

GENEVA, Sept. 9 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahicho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/000554) for "OPTICAL PACKAGE, OPTICAL PACKAGE PRODUCTION METHOD, AND ELECTRONIC DEVICE" on Jan 09, 2025. With publication no. WO/2025/182312, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the Internation...