INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "OPTICAL PACKAGE, MODULE AND METHOD FOR MANUFACTURING OPTICAL PACKAGE"

GENEVA, Jan. 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/016632) for "OPTICAL PACKAGE, MODULE, AND METHOD FOR MANUFACTURING OPTICAL PACKAGE" on May 02, 2025. With publication no. WO/2026/004347, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International P...