GENEVA, Oct. 5 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahicho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソリューションズ株式会社 (神奈川県厚木市旭町四丁目１４番１号) filed a patent application (PCT/JP2025/005637) for "LAMINATED DEVICE, METHOD FOR MANUFACTURING LAMINATED DEVICE, AND ELECTRONIC APPARATUS" on Feb 19, 2025. With publication no. WO/2025/204312, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the...