INTERNATIONAL PATENT: SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD., 广州汉源微电子封装材料有限公司 FILES APPLICATION FOR "REINFORCED SOLDERING SHEET, PREPARATION METHOD THEREFOR AND USE THEREOF"

GENEVA, March 2 -- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD. (No. 58, Nanyun 2nd Road, Science City, Huangpu DistrictGuangzhou, Guangdong 510663), 广州汉源微电子封装材料有限公司 (中国广东省广州市黄埔区科学城南云二路58号) filed a patent application (PCT/CN2023/131730) for "REINFORCED SOLDERING SHEET, PREPARATION METHOD THEREFOR, AND USE THEREOF" on Nov 15, 2023. With publication no. WO/2025/039393, the details related to the patent application was published on Feb 27, 2025.

Notably, the patent application was submitted under ...