INTERNATIONAL PATENT: SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD., 广州汉源微电子封装材料有限公司 FILES APPLICATION FOR "FLUX AND PREPARATION METHOD THEREFOR AND USE THEREOF"

GENEVA, Dec. 28 -- SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD. (No. 58, Nanyun 2nd Road, Science City, Huangpu DistrictGuangzhou, Guangdong 510663), 广州汉源微电子封装材料有限公司 (中国广东省广州市黄埔区科学城南云二路58号) filed a patent application (PCT/CN2025/095874) for "FLUX, AND PREPARATION METHOD THEREFOR AND USE THEREOF" on May 20, 2025. With publication no. WO/2025/261048, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International P...