INTERNATIONAL PATENT: SMT CORPORATION, 주식회사 에스엠티 FILES APPLICATION FOR "THERMALLY CONDUCTIVE COMPOSITE MATERIAL COMPRISING ARTIFICIAL DIAMOND FILLER AND MANUFACTURING METHOD THEREFOR"

GENEVA, June 17 -- SMT CORPORATION (76, Saneop-ro 92beon-gil, Gwonseon-guSuwon-siGyeonggi-do 16643), 주식회사 에스엠티 (경기도수원시권선구 산업로92번길 76) filed a patent application (PCT/KR2023/020267) for "THERMALLY CONDUCTIVE COMPOSITE MATERIAL COMPRISING ARTIFICIAL DIAMOND FILLER AND MANUFACTURING METHOD THEREFOR" on Dec 08, 2023. With publication no. WO/2025/121513, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiza...