INTERNATIONAL PATENT: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, 盛合晶微半导体（江阴）有限公司 FILES APPLICATION FOR "HYBRID BONDING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR"

GENEVA, Nov. 23 -- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION (9 Dongsheng West Road, Jiangyin CityWuxi, Jiangsu 214437), 盛合晶微半导体（江阴）有限公司 (中国江苏省无锡市江阴市东盛西路9号) filed a patent application (PCT/CN2025/093604) for "HYBRID BONDING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR" on May 08, 2025. With publication no. WO/2025/237163, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed b...