INTERNATIONAL PATENT: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, 盛合晶微半导体（江阴）有限公司 FILES APPLICATION FOR "HEAT DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR"

GENEVA, July 7 -- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION (9 Dongsheng West Road, Jiangyin CityWuxi, Jiangsu 214437), 盛合晶微半导体（江阴）有限公司 (中国江苏省无锡市江阴市东盛西路9号) filed a patent application (PCT/CN2024/138329) for "HEAT DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR" on Dec 11, 2024. With publication no. WO/2025/139781, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which i...