INTERNATIONAL PATENT: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, 盛合晶微半导体（江阴）有限公司 FILES APPLICATION FOR "3D VERTICAL INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR"

GENEVA, Nov. 30 -- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION (9 Dongsheng West Road, Jiangyin CityWuxi, Jiangsu 214437), 盛合晶微半导体（江阴）有限公司 (中国江苏省无锡市江阴市东盛西路9号) filed a patent application (PCT/CN2025/093607) for "3D VERTICAL INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR" on May 08, 2025. With publication no. WO/2025/241893, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which i...